Special Issue
Topic: Advances in Machine Learning and AI for Designing Electrochemical Degradation-Resistant Materials
A Special Issue of Journal of Materials Informatics
ISSN 2770-372X (Online)
Submission deadline: 15 Apr 2025
Guest Editor(s)
Guest Editor Assistant(s)
Special Issue Introduction
Electrochemical degradation, whether in marine alloys or water splitting catalysts, limits the potential of otherwise promising materials. Designing materials to resist degradation involves multi-objective optimization, balancing material performance (e.g., overpotential for oxygen evolution) with longevity. The vast search space, including high entropy alloys and novel oxides, poses significant challenges. Recent advances in high-throughput experimentation, machine learning (ML) and artificial intelligence (AI) have aided material exploration, but limited secondary characterization and existing descriptors often fall short for comprehensive material discovery. AI-controlled self-driving labs have shown promise but, to date, are mostly proof of concept studies rather than delivering robust material solutions. Additionally, current studies often focus on short-term degradation, while real-world applications require long-term durability.
This Special Issue will focus on using ML to address challenges in designing materials that resist electrochemical degradation. We invite original research and reviews on topics including:
1. Novel high-throughput experimental and computational workflows to investigate novel alloys classes;
2. Rich material representations for ML models predicting degradation;
3. ML and AI tools for forecasting long-term degradation;
4. Supervised and unsupervised methods for analyzing degradation data, such as electrochemical impedance and X-ray photoelectron spectroscopy;
5. ML tools for deriving physical mechanisms from electrochemical degradation studies.
Submission Deadline
Submission Information
For Author Instructions, please refer to https://www.oaepublish.com/jmi/author_instructions
For Online Submission, please login at https://oaemesas.com/login?JournalId=JMI&SpecialIssueId=JMI240813
Submission Deadline: 15 Apr 2025
Contacts: Mengyu Yang, Assistant Editor, JMI@oaepublish.com