Topic: Unraveling the Dynamic Interplay between Microstructure and Functional Characteristics in Advanced Electroceramics
Guest Editor(s)
Prof. Dou Zhang
State Key Laboratory of Powder Metallurgy, Central South University, Changsha, Hunan, China.
Prof. Jing Guo
School of Materials Science and Engineering, Xi’an Jiaotong University, Xi'an, Shaanxi, China.
Prof. Hang Luo
State Key Laboratory of Powder Metallurgy, Central South University, Changsha, Hunan, China.
Special Issue Introduction
Electroceramics exhibit a plethora of outstanding properties, including high mechanical strength, superior insulation resistance, exceptional temperature and humidity tolerance, radiation resilience, and a broad range of dielectric constants. Consequently, they are extensively employed across various sectors such as electronics, telecommunications, automotive industries, renewable energy, aerospace, and defense. Recognizing the crucial role of electroceramics in advancing economic and societal development, we are organizing a Special Issue titled "Unraveling the dynamic interplay between microstructure and functional characteristics in advanced electroceramics". This issue will encompass but not be limited to the following topics: (1) Manufacturing and processing techniques for electroceramics; (2) Dielectrics, piezoelectrics, ferroelectrics, and ferroics; (3) Electrical, optical, and magnetic characteristics of electroceramics; (4) Device applications and innovations; (5) Advanced characterization and simulation methodologies. We cordially invite scholars to submit their manuscripts for consideration.
Keywords
Ceramics, piezoelectrics, dielectrics, ferroelectrics, devices, manufacturing, performances, characterization, simulation
Submission Deadline
20 Mar 2025
Submission Information
For Author Instructions, please refer to https://www.oaepublish.com/microstructures/author_instructions
For Online Submission, please login at https://oaemesas.com/login?JournalId=microstructures&IssueId=M241026
Submission Deadline: 20 Mar 2025
Contacts: Celia, Assistant Editor, Microstructures@oaepublish.com
