fig1

Figure 1. Strategies toward the fabrication of deformable Micro-LEDs, including substrate removal (A-C), micro-assembly (D-F), and mechanical design (E-I). Schematics for the substrate removal methods, including (A) laser lift-off, (B) chemical lift-off, and (C) mechanical lift-off^[35]; Representative transfer methods for Micro-LED integration on curvilinear substrates reported recently, including (D) ballon-shaped stamp transfer^[60], (E) roller transfer^[11], and (F) photosensitive tape-assisted transfer^[17]; Typical mechanical structure designs for improved stretchability of Micro-LED devices, including (G) island-bridge design^[61], (H) buckling structures^[16], and (I) Kirigami structures^[9]. Figure 1A-C reproduced under the terms of the CC-BY Creative Commons Attribution 4.0 International license^[35];Figure 1D adapted with permission from ref.^[60]. Copyright 2021 Springer Nature; Figure 1E reproduced under the terms of the CC-BY Creative Commons Attribution 4.0 International license^[11]; Figure 1F reproduced under the terms of the CC-BY Creative Commons Attribution 4.0 International license ^[17];Figure 1G reproduced under the terms of the CC-BY Creative Commons Attribution 4.0 International license^[61]; Figure 1H adapted with permission from ref.^[16]. Copyright 2009 AAAS; Figure 1I adapted with permission from ref.^[9]. Copyright 2022 Wiley-VCH. Micro-LED: Micro-scale light-emitting diode.