Editorial Board
41 Editors in 9 Countries/Regions
Editor-in-Chief
YongAn Huang
yahuang@hust.edu.cnSchool of Mechanical Science & Engineering, Huazhong University of Science and Technology, Wuhan, Hubei, China.
Research Interests: Flexible electronics; Printed electronics; Electronic skin; Inkjet printing; Laser fabrication
Associate Editors
Jun Chen 
Department of Bioengineering, University of California, Los Angeles, CA, USA.
Research Interests: Soft matter; Condensed matter physics; Soft bioelectronics; Smart textiles; Body area networks; Personalized healthcare; Energy and sustainability
Guoying Gu
School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai, China.
Research Interests: Soft robotics; Wearable intelligent systems; Smart materials actuators, sensors and motion control; Machine learning and 3D printing.
Junwei Gu
School of chemistry and chemical engineering, Northwestern Polytechnical University, Xi'an, Shaanxi, China.
Research Interests: Thermally conductive polymer-based composites; Fiber-reinforced wave-transparent polymer-based composites; Electromagnetic interference shielding polymer-based composites.
Liqiang Mai
School of Materials Science and Engineering, Wuhan University of Technology, Wuhan, Hubei, China.
Research Interests: Nanowire materials and devices for energy storage; Solid-state batteries and electrocatalysis; Micro/nano energy devices
Advisory Board Member
John Wang
Department of Materials Science and Engineering, National University of Singapore, Singapore, Singapore.
Research Interests: Carbon-based materials; Nanohybrids; Mesoporous materials; Energy Storage; Biomedical applications
Founding Editor-in-Chief
Zhifeng Ren
Department of Physics and Texas Center for Superconductivity at the University of Houston (TcSUH), University of Houston, Houston, TX, USA.
Research Interests: Flexible transparent electrodes; High performance thermoelectric materials; Catalysts for water splitting
Founding Editors
Chuanfei Guo
Department of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen, Guangdong, China.
Research Interests: Electronic-skins; Body-comformal/flexible electronics; Abnormal micro-nano fabrication technology
Cunjiang Yu
Department of Engineering Science and Mechanics, Department of Biomedical Engineering, and Materials Research Institute, Pennsylvania State University, University Park, PA, USA.
Research Interests: Soft sensors and electronics; Thin film organic and inorganic electronics; Biomedical sensors and electronics; Soft robotics
Editorial Board Members
Renkun Chen
Department of Mechanical and Aerospace Engineering, University of California, San Diego, CA, USA.
Research Interests: Thermoelectric materials and devices; Micro and nano-scale heat transfer; Phase change heat transfer; Nanoscalle energy conversion and storage
Wei Chen
Department of Physics, University of Texas at Arlington, Arlington, TX, USA.
Research Interests: Nanotechnology; nanomaterials; luminescence; cancer nanotechnology; photodynamic therapy
Xiaodong Chen
School of Materials Science and Engineering, Nanyang Technological University, Singapore, Singapore.
Research Interests: Soft materials; Flexible electronics
Zhigang Chen
School of Chemistry and Physics, Queensland University of Technology, Brisbane, QLD, Australia.
Research Interests: Thermoelectric materials and devices; Topological Insulators; Compound Semiconductors; Functional Materials; Nanotechnology; Compound Semiconductors; Nanotechnology; Functional Materials
Huanyu Cheng
Penn State College of Engineering, University Park, Pennsylvania, USA
Research Interests: Advanced Materials and Devices; Applied Mechanics and Biomechanics; Nanoscience, Bionanoscience and Engineering; Structural and Human Health Monitoring
Nicholas X. Fang
Department of Mechanical Engineering, University of Hong Kong, Hong Kong, China.
Research Interests: Engineered optical; Acoustic metamaterials
Wei Hong
Department of Mechanics and Aerospace Engineering, Southern University of Science and Technology, Shenzhen, Guangdong, China.
Research Interests: Dielectric materials; Fracture mechanics; Hydrogel; Materials science; Soft matter; Solid mechanics
Dae-Hyeong Kim
School of Chemical and Biological Engineering, Seoul National University, Seoul, Korea.
Research Interests: Soft electronics
Flexible and Stretchable Electronics Based on Nanotechnology
Seung Hwan Ko
Department of Mechanical Engineering, Seoul National University, Seoul, Korea.
Research Interests: Flexible; Stretchable and Wearable Electronics Developement; Energy Devices; Nano/micro Process Development; Laser Assisted Low Temperature Direct Patterning
Nae-Eung Lee
School of Advanced Materials Science & Engineering, Sungkyunkwan University, Seoul, South Korea
Research Interests: stretchable electronic; Stretchable Sensors; Nano-materials; Biosensing; Point-of-Care Testing (POCT); Drug Testing
Ziqi Liang
Department of Materials Science, Fudan University, Shanghai, China.
Research Interests: Organic/perovskite semiconductors based opto-thermoelectronics
Junming Liu
School of Physics, Nanjing University, Nanjing, Jiangsu, China.
Research Interests: Ferroelectrics/multiferroics; Multifunctional materials; Computational materials
Xing Ma
School of Materials Science and Engineering, Harbin Institute of Technology (Shenzhen), Shenzhen, Guangdong, China
Research Interests: Biomaterials, Functional Nanomaterials, and Micro-Nanorobots
A highly stretchable and sintering-free liquid metal composite conductor enabled by ferrofluid
Recent advancements in liquid metal enabled flexible and wearable biosensors
Carlo Massaroni
Departmental Faculty of Engineering, Università Campus Bio-Medico di Roma, Rome, Italy
Research Interests: Wearable; Sensors; Flexible electronics; Biomarkers; Physiological measurements; Algorithms; Mechanical measurements
Tunable soft pressure sensors based on magnetic coupling mediated by hyperelastic materials
Takao Mori
International Center for Materials Nanoarchitectonics, National Institute for Materials Science, Tsukuba, Japan.
Research Interests: Nanomaterials and Nanobiology; Thermal Conductivity; Thermoelectrics
Kornelius Nielsch
Institute for Metallic Materials, Dresden University of Technology, Dresden, Germany.
Research Interests: Thermoelectric nanowires; Nanograined bulk materials and devices; Synthesis of 3D nanostructures
Mehmet Ozturk
Department of Electrical and Computer Engineering, NC State University, Raleigh, NC, USA.
Research Interests: Flexible thermoelectric devices
Caofeng Pan
Institute of Atomic Manufacturing, Beihang University, Beijing, China.
Research Interests: Smart materials & sensors; Flexible electronics; Wearable electronics
Damiano Pasini
Department of Mechanical Engineering, McGill University, Quebec, Canada.
Research Interests: Soft mechanical metamaterials; Soft robotics; Kirigami; Origami; Morphing metamaterials; Multistability in soft matter; Multiphysics; Multiscale mechanics.
Srinivasa R. Raghavan
Department of Chemical & Biomolecular Engineering, University of Maryland, College Park, MD, USA.
Research Interests: Polymer and colloidal gels; Self-assembled systems; Containers for drug delivery; "smart" fluids; Scattering techniques/rheology; Polymer-CNT nanocomposites
John A. Rogers
Departments of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.
Research Interests: Soft materials for conformal electronics; Nanophotonic structures; Microfluidic devices
Young Min Song
School of Electrical Engineering and Computer Science, Gwangju Institute of Science and Technology, Gwangju, Korea.
Research Interests: Flexible Optoelectronics/Photonics;semiconductor;optoelectronics;photonics;biomimetics;flexible electronics
Flexible and Stretchable Electronics Based on Nanotechnology
Da-Wei Wang
School of Chemical Engineering, University of New South Wales, Sydney, NSW, Australia.
Research Interests: Nanomaterials, Functional Materials, Physical Chemistry of Materials, Electrochemistry, Energy Generation, Conversion and Storage Engineering
Joseph Wang
Department of Chemical and Nano Engineering, the University of California San Diego, La Jolla, CA, USA
Research Interests: Wearable biosensors; Wearable sensors; Nanomachines; Energy harvesting; Biosensors; Fuel cells; Glucose monitoring
Zhigang Wu
School of Optical and Electronic Information, Huazhong University of Science and Technology, Wuhan, Hubei, China.
Research Interests: Bionic Microrobot; Soft robot; Soft intelligent Sensing; Soft base material advanced manufacturing
William W. Yu
Department of Chemistry and Physics, Louisiana State University in Shreveport, Shreveport, United States
Research Interests: Solution-Dispersible Nanomaterials; Quantum Dots; Metal Nanoparticles; Metal Oxide Nanoparticles; Alternative Energy; Nanomaterials Application; Biomedicine
Xinge YU
Department of Biomedical Engineering, City University of Hong Kong, Hong Kong, China.
Research Interests: Skin-integrated electronics; Haptic interfaces; Bio-integrated electronics; human-machine interfaces; Biomedical engineering
Yihui Zhang
Department of Engineering Mechanics, Tsinghua University, Beijing, China.
Research Interests: Mechanically-guided 3D assembly; Unusual soft materials; Stretchable and flexible electronics; Mechanics of smart materials and structures
Flexible and Stretchable Electronics Based on Nanotechnology
Yu Shrike Zhang
Department of Medicine, Harvard Medical School, Boston, MA, USA.
Research Interests: 3D bioprinting; Organs-on-chips; Microfluidics; Bioanalysis
Li-Dong Zhao
School of Materials Science and Engineering, Beihang University, Beijing, China.
Research Interests: Thermoelectric energy materials; Superconducting materials
Ruike Zhao
Department of Mechanical Engineering, Stanford University, Stanford, CA, USA.
Research Interests: Soft materials; Soft robotics; Biomechanics; Bioengineering
Chunyi Zhi
Department of Materials Science and Engineering, City University of Hong Kong, Hong Kong, China.
Research Interests: Wearable energy storage devices; Aqueous electrolyte battery
All members of the Editorial Board have identified their affiliated institutions or organizations, along with the corresponding country or geographic region. OAE Publishing Inc. remains neutral with regard to any jurisdictional claims.
