45 Editors in 10 Countries/Regions
Editor-in-Chief
yahuang@hust.edu.cn School of Mechanical Science & Engineering, Huazhong University of Science and Technology, Wuhan, Hubei, China.
Research Interests: Flexible electronics; Printed electronics; Electronic skin; Inkjet printing; Laser fabrication
Associate Editors
Department of Bioengineering, University of California, Los Angeles, CA, USA.
Research Interests: Soft matter; Condensed matter physics; Soft bioelectronics; Smart textiles; Body area networks; Personalized healthcare; Energy and sustainability
School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai, China.
Research Interests: Soft robotics; Wearable intelligent systems; Smart materials actuators, sensors and motion control; Machine learning and 3D printing.
School of chemistry and chemical engineering, Northwestern Polytechnical University, Xi'an, Shaanxi, China.
Research Interests: Thermally conductive polymer-based composites; Fiber-reinforced wave-transparent polymer-based composites; Electromagnetic interference shielding polymer-based composites.
School of Materials Science and Engineering, Wuhan University of Technology, Wuhan, Hubei, China.
Research Interests: Nanowire materials and devices for energy storage; Solid-state batteries and electrocatalysis; Micro/nano energy devices
Advisory Board Member
Department of Materials Science and Engineering, National University of Singapore, Singapore, Singapore.
Research Interests: Carbon-based materials; Nanohybrids; Mesoporous materials; Energy Storage; Biomedical applications
Founding Editor-in-Chief
Department of Physics and Texas Center for Superconductivity at the University of Houston (TcSUH),
University of Houston, Houston, TX, USA.
Research Interests: Flexible transparent electrodes; High performance thermoelectric materials; Catalysts for water splitting
Founding Editors
Department of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen, Guangdong, China.
Research Interests: Electronic-skins; Body-comformal/flexible electronics; Abnormal micro-nano fabrication technology
Department of Engineering Science and Mechanics, Department of Biomedical Engineering, and Materials Research Institute, Pennsylvania State University, University Park, PA, USA.
Research Interests: Soft sensors and electronics; Thin film organic and inorganic electronics; Biomedical sensors and electronics; Soft robotics
Editorial Board Members
Department of Mechanical and Aerospace Engineering, University of California, San Diego, CA, USA.
Research Interests: Thermoelectric materials and devices; Micro and nano-scale heat transfer; Phase change heat transfer; Nanoscalle energy conversion and storage
Department of Physics, University of Texas at Arlington, Arlington, TX, USA.
Research Interests: Nanotechnology; nanomaterials; luminescence; cancer nanotechnology; photodynamic therapy
School of Materials Science and Engineering, Nanyang Technological University, Singapore, Singapore.
Research Interests: Soft materials; Flexible electronics
School of Chemistry and Physics, Queensland University of Technology, Brisbane, QLD, Australia.
Research Interests: Thermoelectric materials and devices; Topological Insulators; Compound Semiconductors; Functional Materials; Nanotechnology; Compound Semiconductors; Nanotechnology; Functional Materials
Penn State College of Engineering, University Park, Pennsylvania, USA
Research Interests: Advanced Materials and Devices; Applied Mechanics and Biomechanics; Nanoscience, Bionanoscience and Engineering; Structural and Human Health Monitoring
Department of Mechanical Engineering, University of Hong Kong, Hong Kong, China.
Research Interests: Engineered optical; Acoustic metamaterials
Department of Mechanics and Aerospace Engineering, Southern University of Science and Technology, Shenzhen, Guangdong, China.
Research Interests: Dielectric materials; Fracture mechanics; Hydrogel; Materials science; Soft matter; Solid mechanics
School of Chemical and Biological Engineering, Seoul National University, Seoul, Korea.
Research Interests: Soft electronics
Department of Mechanical Engineering, Seoul National University, Seoul, Korea.
Research Interests: Flexible; Stretchable and Wearable Electronics Developement; Energy Devices; Nano/micro Process Development; Laser Assisted Low Temperature Direct Patterning
School of Advanced Materials Science & Engineering, Sungkyunkwan University, Seoul, South Korea
Research Interests: stretchable electronic; Stretchable Sensors; Nano-materials; Biosensing; Point-of-Care Testing (POCT); Drug Testing
Department of Materials Science, Fudan University, Shanghai, China.
Research Interests: Organic/perovskite semiconductors based opto-thermoelectronics
School of Physics, Nanjing University, Nanjing, Jiangsu, China.
Research Interests: Ferroelectrics/multiferroics; Multifunctional materials; Computational materials
School of Materials Science and Engineering, Harbin Institute of Technology (Shenzhen), Shenzhen, Guangdong, China
Research Interests: Biomaterials, Functional Nanomaterials, and Micro-Nanorobots
Departmental Faculty of Engineering, Università Campus Bio-Medico di Roma, Rome, Italy
Research Interests: Wearable; Sensors; Flexible electronics; Biomarkers; Physiological measurements; Algorithms; Mechanical measurements
International Center for Materials Nanoarchitectonics, National Institute for Materials Science, Tsukuba, Japan.
Research Interests: Nanomaterials and Nanobiology; Thermal Conductivity; Thermoelectrics
Institute for Metallic Materials, Dresden University of Technology, Dresden, Germany.
Research Interests: Thermoelectric nanowires; Nanograined bulk materials and devices; Synthesis of 3D nanostructures
Department of Electrical and Computer Engineering, NC State University, Raleigh, NC, USA.
Research Interests: Flexible thermoelectric devices
Institute of Atomic Manufacturing, Beihang University, Beijing, China.
Research Interests: Smart materials & sensors; Flexible electronics; Wearable electronics
Department of Chemistry, Pittsburg State University, Pittsburg, KS, USA
Research Interests: Electrospinning, Solution Spinning and Melt Extrusion; Functional Polymers, Composite, Fibers and Particles for Drug Delivery; Surface Functionalization of Textiles Using Different Coating Materials; Developing Sensors for Personal Protection Equipment; Developing Sensors for Food Packaging
Department of Mechanical Engineering, McGill University, Quebec, Canada.
Research Interests: Soft mechanical metamaterials; Soft robotics; Kirigami; Origami; Morphing metamaterials; Multistability in soft matter; Multiphysics; Multiscale mechanics.
Department of Chemical & Biomolecular Engineering, University of Maryland, College Park, MD, USA.
Research Interests: Polymer and colloidal gels; Self-assembled systems; Containers for drug delivery; "smart" fluids; Scattering techniques/rheology; Polymer-CNT nanocomposites
Departments of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.
Research Interests: Soft materials for conformal electronics; Nanophotonic structures; Microfluidic devices
School of Electrical Engineering and Computer Science, Gwangju Institute of Science and Technology, Gwangju, Korea.
Research Interests: Flexible Optoelectronics/Photonics;semiconductor;optoelectronics;photonics;biomimetics;flexible electronics
School of Chemical Engineering, University of New South Wales, Sydney, NSW, Australia.
Research Interests: Nanomaterials, Functional Materials, Physical Chemistry of Materials, Electrochemistry, Energy Generation, Conversion and Storage Engineering
Department of Chemical and Nano Engineering, the University of California San Diego, La Jolla, CA, USA
Research Interests: Wearable biosensors; Wearable sensors; Nanomachines; Energy harvesting; Biosensors; Fuel cells; Glucose monitoring
School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore, Singapore.
Research Interests: fiber-based devices; multi-functional fibers; bio-fiber interfaces; in-fiber energy generation and storage
Shandong Key Laboratory of Low Dimensional Materials and Polymer Composites, College of Materials Science and Engineering, Qingdao University, Qingdao, Shandong, China
Research Interests: Dielectric properties; Thermal conductivity; Electromagnetic shielding; Electromagnetic wave absorbing materials; Breakdown performance
School of Optical and Electronic Information, Huazhong University of Science and Technology, Wuhan, Hubei, China.
Research Interests: Bionic Microrobot; Soft robot; Soft intelligent Sensing; Soft base material advanced manufacturing
Department of Chemistry and Physics, Louisiana State University in Shreveport, Shreveport, United States
Research Interests: Solution-Dispersible Nanomaterials; Quantum Dots; Metal Nanoparticles; Metal Oxide Nanoparticles; Alternative Energy; Nanomaterials Application; Biomedicine
Department of Biomedical Engineering, City University of Hong Kong, Hong Kong, China.
Research Interests: Skin-integrated electronics; Haptic interfaces; Bio-integrated electronics; human-machine interfaces; Biomedical engineering
Department of Engineering Mechanics, Tsinghua University, Beijing, China.
Research Interests: Mechanically-guided 3D assembly; Unusual soft materials; Stretchable and flexible electronics; Mechanics of smart materials and structures
Department of Medicine, Harvard Medical School, Boston, MA, USA.
Research Interests: 3D bioprinting; Organs-on-chips; Microfluidics; Bioanalysis
School of Materials Science and Engineering, Beihang University, Beijing, China.
Research Interests: Thermoelectric energy materials; Superconducting materials
Department of Mechanical Engineering, Stanford University, Stanford, CA, USA.
Research Interests: Soft materials; Soft robotics; Biomechanics; Bioengineering
Department of Materials Science and Engineering, City University of Hong Kong, Hong Kong, China.
Research Interests: Wearable energy storage devices; Aqueous electrolyte battery
Department of Chemistry, Alfaisal University, Riyadh, Saudi Arabia
Research Interests: Biosensors; recognition receptors; lab on a chip; soft materials sensing
All members of the Editorial Board have identified their affiliated institutions or organizations, along with the corresponding country or geographic region. OAE Publishing Inc. remains neutral with regard to any jurisdictional claims.