fig4

Figure 4. The top-view SEM images of the (A) conventional and (C) PASP perovskite films with pressure of 4,900 Pa. Cross-sectional SEM images of the (B) conventional and (D) PASP perovskite films with an additional pressure of 4,900 Pa. (A-D) is quoted with permission from Luo et al.^[90] The mechanical simulation of (E) fp- and (F) hp-OIHP films. (G) The top-view SEM images of hp-OIHP film. (H) Schematic diagram of grain boundaries. (E-H) is quoted with permission from Chun et al.^[91]. (I) Schematic diagram of lamination. (J) Illustration of a diffusion bonding process. (I and J) is quoted with permission from Lanaghan et al.^[92]. (K) SEM images of untreated, CIP-treated, HIP-treated, and annealed perovskite layers. (K) is quoted with permission from Matsushima et al.^[69]. (L) Optical images of perovskite precursor, OPS, and TPS films. (L) is quoted with permission from Wang et al.^[95]. (M) XRD patterns of pristine and PiP perovskite films with diverse temperatures. (M) is quoted with permission from Huang et al.^[96]. (N) Phi-scan patterns of SnO₂-control and SnO₂-TP films. (N) is quoted with permission from Zhang et al.^[82]. (O) GIWAXS images of SCN-TP film. (O) is quoted with permission from Zhu et al.^[51].