fig3

Pressure-assisted crystallization techniques for high-performance metal halide perovskite devices

Figure 3. (A) Schematic illustration of the PTS process for the fabrication of the MAPbI3 film. Top-view SEM images of the (B) PTS-150 film and (C) CA film. (D) Grain size distribution of the PTS-150 film and CA film. (E) Cross-sectional SEM image of the PTS-150 film. (F) Time-resolved PL spectra of PTS-150 and CA films. (A-F) is quoted with permission from Wang et al.[81]. (G) Top-view SEM image of SnO2-TP75 film. (H) Cross-sectional SEM images of SnO2-TP75 film of different thicknesses. (I) XRD patterns of control and TP films. (G-I) is quoted with permission from Zhang et al.[82]. (J) Setup configuration of FAST. (K) Mass transport mechanisms involved in the sintering, including volume diffusion, evaporation and solidification, grain boundary diffusion, and surface diffusion. (L) The as-milled MAPbI3 powders. (M) The cross-section SEM image of the FAST-synthesized MAPbI3 bulk. (J-M) is quoted with permission from Zheng et al.[83]. (N) Schematic diagram of the preparation process for the CHC-treated perovskite film. (O) CLFM image of the ETL/CHC-treated perovskite film/HTL film. (P) Statistical histograms of PL intensities in areas ROI2, ROI3, and ROI4 of (O). (N-P) is quoted with permission from Zhang et al.[84].

Microstructures
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