fig6

Figure 6. (A) Photograph and schematic illustration of the PI 95 picoindenter in TEM^[50]. Reproduced with permission. Copyright 2016, Elsevier. (B) The instrumentation and the experimental setup for the in-situ bending tests, including the XNano TEM holder and control box. Reproduced with permission^[44]. Copyright 2019, Springer Nature. (C) Left: The setup for in-situ TEM tensile tests with the structured conductive diamond tip acting as a gripper. Right: True stress versus true strain data for repeated loading of a tensile copper sample with an initial diameter of 133 nm and orientation of (100). Reproduced with permission^[45]. Copyright 2011, ACS publications.