fig10

Figure 10. Construction of flexible EMI PCCs based on metal particles. (A) Preparation of FMP composites, flexible display of digital images, thermal storage capacity, thermal charging, and schematic of EMI shielding mechanism. Reproduced with permission from ref^[147]. Copyright 2024, Elsevier; (B) Preparation of MPA_χ-PEG composites, thermal conductivity, shape memory capability, schematic diagram of thermal management, and EMI shielding mechanism for cell phone chips. Reproduced with permission from ref^[148]. Copyright 2022, Elsevier; (C) Schematic of composite material preparation, thermal storage capacity, photothermal conversion, thermal management, and EMI shielding mechanism. Reproduced with permission from ref^[149]. Copyright 2023, Elsevier. EMI: Electromagnetic interference; PCCs: phase change composites; FMP: flexible and magnetically fastened phase change material; PEG: polyethylene glycol.