fig6

Figure 6. Transfer fabrication technology for micro-cylindrical electronics manufacturing. (A) Conformal bending of flexible thin film electronics. Reproduced with permission^[44]. Copyright 2024, Springer Nature; (B) Direct wrapping of flexible circuits on high-curvature micro-cylindrical surfaces. Reproduced with permission^[32]. Copyright 2024, Springer Nature; (C) Innovative wrapping mold design to reduce errors. Reproduced with permission^[49]. Copyright 2018, De Gruyter, Berlin/Boston; (D) Mechanical assembly and adhesive connection scheme for thin-walled multilayer structures. Reproduced with permission^[105]. Copyright 2015, Elsevier.