fig3

Figure 3. (A) The ideal shear modulus of flexible adhesives in temperature sweep test. With low T_g adhesives, it facilitates the formation of multiple neutral planes through the entire integrated structures; (B) DMA and rheometer are used to measure the viscoelastic properties of flexible adhesives such as temperature sweep, frequency sweep, creep and recovery, S-S curve, and so on; (C) The plastic-viscoelastic deformation occurs during the peel test. The stronger deformation occurs at peel front, the larger adhesion force is detected. T_g: Transition temperature; DMA: dynamic mechanical analysis.