fig3

Figure 3. Performance characterization of liquid metal-based sensing circuits under different test conditions. (A) Schematic diagram of four different test methods, including stretching, twisting, bending, and heating; (B) Normalized resistance changes of liquid metal-based sensing circuit encapsulated in SEBS during stretch-release tests at five different maximum strains; (C) Normalized resistance changes of liquid metal-based sensing circuits held at different strains for 30 s; (D) Fatigue resistance characterization of the sensing circuit during 600 stretch-release cycles and its resistance changes in later stages; (E) Resistance changes of liquid metal-based sensing circuits at different twisting angles; (F) Damage resistance characterization of the sensing circuit during 500 bend-recovery cycles and resistance changes during six cycles of them; (G) Resistance changes of liquid metal-based sensing circuits under different heating temperatures.