fig4

Reliable metal alloy contact for Mg<sub>3+δ</sub>Bi<sub>1.5</sub>Sb<sub>0.5</sub> thermoelectric devices

Figure 4. Microstructural morphology of the contact interface in the single TE leg sample composed of NiFe and Mg3+δBi1.5Sb0.5 after aging and thermal cycling and quenching. Inset in (B): EDS line scan across the contact interface in the same sample.

Soft Science
ISSN 2769-5441 (Online)
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