fig14
![Recent progress in pressure and temperature tactile sensors: principle, classification, integration and outlook](https://image.oaes.cc/0df29de9-dd7a-4412-be2e-96cac20c4363/4261.fig.14.jpg)
Figure 14. (A) A modified electrical grounding circuit and designed PCB board for 32 × 32 piezoresistive tactile arrays. This figure is quoted with permission from Luo et al.[64]. (B) Signal process circuit for the capacitive bimodal tactile sensor array. This figure is quoted with permission from Chen et al.[13]. (C) Designed readout circuit for fingerprint sensor. This figure is quoted with permission from