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Editorial  |  Open Access  |  27 Mar 2024

Health monitoring: the key technology for sustainable utilization of insulated gate bipolar transistors

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Green Manuf Open 2024;2:7.
10.20517/gmo.2024.032201 |  © The Author(s) 2024.
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INTRODUCTION

Insulated Gate Bipolar Transistors (IGBTs), as core components in high-power applications, play a crucial role in modern energy conversion and power transmission systems[1,2]. However, facing long-duration high-load operations and complex working environments, these devices may encounter performance degradation and even failure, severely threatening the power system reliability[3]. To address this challenge, health monitoring of IGBTs has become a widely focused research area[4-6]. The core objective is to monitor the operational status of devices in real time and identify any potential failures or performance declines in advance, ensuring the continuous and stable operation of power systems[7]. Their health monitoring has shown great potential in preventative maintenance and device reuse. Accurately monitoring their health status not only extends their lifespan but also promotes more efficient reuse, thereby contributing to sustainable utilization in the power electronics industry[8].

FAILURE MODES OF IGBTS

The failure modes of IGBTs are closely related to the electrical, thermal, and mechanical stresses they endure[9]. On the one hand, voltage and current fluctuations can lead to transient failures. On the other hand, long-duration operation may cause cumulative damage and aging[10]. These failure modes are mainly divided into two categories: chip- and package-level failures. Chip-level failures usually occur instantaneously and are difficult to avoid through traditional condition monitoring methods. Package-level failures in IGBTs, such as bonding wire and solder layer failures, accumulate over time. Therefore, health monitoring of IGBTs mainly focuses on preventing package-level failures.

HEALTH MONITORING METHODS FOR IGBTS

Health monitoring of IGBTs is key to their sustainable utilization, mainly including junction temperature monitoring, electrical parameter monitoring, and life expectancy estimation[11]. Junction temperature-based monitoring approaches involve measuring the junction temperature of IGBT modules using physical contact, infrared thermal imaging, and temperature-sensitive parameter techniques to ensure the reliability of IGBTs and avoid overheating[12]. Electrical parameter monitoring entails measuring and analyzing the electrical characteristics of IGBTs to assess their health status. This monitoring provides real-time information about their health, crucial for averting failures and maintaining stable power system operation[13,14]. Life expectancy estimation of IGBTs employs data-driven methods and physical models to predict their remaining lifespan under normal operating conditions. This prediction is essential for planning maintenance, preventing unexpected failures, and prolonging equipment life[15,16].

SUSTAINABILITY AND ENVIRONMENTAL IMPACT OF IGBT HEALTH MONITORING

The health monitoring of IGBTs not only enhances the longevity and reliability of power systems but also plays a pivotal role in promoting environmental sustainability. Effective health monitoring and reliability prediction of IGBTs directly influence energy efficiency. By preventing failures and reducing downtime, energy loss during power conversion and transmission is minimized. This translates to reduced energy consumption overall, supporting efforts in energy conservation. Furthermore, sustainable utilization and extended lifespan of IGBTs, facilitated by accurate health monitoring, aid in reducing electronic waste. This aspect is critical in the context of environmental protection, as it mitigates the ecological impact associated with the disposal and recycling of electronic components. Moreover, optimizing the operation and maintenance of IGBTs can indirectly contribute to emissions reduction. By ensuring efficient functioning and reducing the need for frequent replacements, the carbon footprint associated with manufacturing and disposing of these components is significantly decreased. Therefore, the health monitoring of IGBTs is not just a technical necessity for power system reliability but also a strategic approach to achieving more sustainable energy practices and reducing environmental impact.

POTENTIAL OF DIFFERENT METHODS IN ACHIEVING SUSTAINABLE UTILIZATION OF IGBTS

Junction temperature monitoring can prevent overheating in a timely manner and enable efficient thermal management decisions. By analyzing temperature trends, preventive maintenance can be initiated, extending the life of IGBTs. Electrical parameter monitoring is crucial for identifying potential problems and preventive maintenance. It helps to respond to abnormal fluctuations promptly, preventing damage to IGBTs, and enables predictive maintenance, reducing the risk of failures and maintenance costs. Life expectancy prediction is vital for recycling and reusing IGBTs, estimating their remaining operational time, guiding efficient recycling decisions, and enhancing the resource recycling efficiency.

FUTURE TRENDS IN HEALTH MONITORING

In the field of IGBT health monitoring, future trends are expected to closely integrate intelligent technology with the concept of sustainable utilization. With the advancement of artificial intelligence and the Internet of Things, more intelligent monitoring methods are expected to emerge. These techniques can monitor the operating state of IGBTs in real time and accurately, using efficient data analysis to predict potential failures, effectively reducing maintenance costs and downtime. Additionally, the integration of preventive maintenance strategies will not only extend the lifespan of IGBTs but also improve the efficiency and reliability of device operation, reducing resource wastage. Moreover, these monitoring methods will focus more on reusing and recycling IGBTs. This intelligent technology lays the foundation for building a more reliable, efficient, and environmentally friendly power system.

DECLARATIONS

Authors’ contributions

Conceptualization, methodology, software, validation, data curation, writing - original draft: Liu H

Formal analysis, investigation, writing-review and editing: Li X

Resources, writing - review and editing, project administration, visualization, supervision, funding acquisition: Liu Z

Availability of data and materials

The data supporting the findings of this study are not publicly available due to privacy concerns. However, the data are available from the corresponding author Zhifeng Liu, upon reasonable request and with permission from Anhui Province Key Laboratory of Low Carbon Recycling Technology and Equipment for Mechanical and Electrical Products.

Financial support and sponsorship

This work is financially supported by the Ministry of Science and Technology of the People’s Republic of China (No. 2019YFC1908002).

Conflicts of interest

All authors declared that there are no conflicts of interest. Liu Z is an Editorial Board Member of the journal Green Manufacturing Open.

Ethical approval and consent to participate

Not applicable.

Consent for publication

Not applicable.

Copyright

© The Author(s) 2024.

REFERENCES

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2. Liu Z, Zhu C. IGBT life prediction based on elman neural network model. Semicond Technol 2019;44:395-400. (in Chinese).

3. Wang C, Ji B, Song X, Pickert V, Cao W. IGBT condition monitoring with system identification methods. In: 2014 IEEE Conference and Expo Transportation Electrification Asia-Pacific (ITEC Asia-Pacific); 2014 Aug 31 - Sep 03; Beijing, China. IEEE; 2014. p. 1-6.

4. Xiang D, Ran L, Tavner P, Yang S, Bryant A, Mawby P. Condition monitoring power module solder fatigue using inverter harmonic identification. IEEE Trans Power Electron 2012;27:235-47.

5. Tian B, Qiao W, Wang Z, Gachovska T, Hudgins JL. Monitoring IGBT’s health condition via junction temperature variations. In: 2014 IEEE Applied Power Electronics Conference and Exposition - APEC 2014; 2014 Mar 16-20; Fort Worth, USA. IEEE; 2014. pp. 2550-5.

6. Yang S, Xiang D, Bryant A, Mawby P, Ran L, Tavner P. Condition monitoring for device reliability in power electronic converters: a review. IEEE Trans Power Electron 2010;25:2734-52.

7. Zhang X, Wang M, Li X, et al. A method for improving the thermal shock fatigue failure resistance of IGBT modules. IEEE Trans Power Electron 2020;35:8532-9.

8. Choi UM, Blaabjerg F, Munk-Nielsen S, Jørgensen S, Rannestad B. Condition monitoring of IGBT module for reliability improvement of power converters. In: 2016 IEEE Transportation Electrification Conference and Expo, Asia-Pacific (ITEC Asia-Pacific); 2016 Jun 01-04; Busan, Korea. IEEE; 2016. pp. 602-7.

9. Deng E, Zhao Z, Xin Q, Zhang J, Huang Y. Analysis on the difference of the characteristic between high power IGBT modules and press pack IGBTs. Microelectron Reliab 2017;78:25-37.

10. Mohsenzade S, Zarghany M, Kaboli S. A series stacked IGBT switch with robustness against short-circuit fault for pulsed power applications. IEEE Trans Power Electron 2018;33:3779-90.

11. Huang H, Mawby PA. A lifetime estimation technique for voltage source inverters. IEEE Trans Power Electron 2013;28:4113-9.

12. Strauss B, Lindemann A. Measuring the junction temperature of an IGBT using its threshold voltage as a temperature sensitive electrical parameter (TSEP). In: 2016 13th International Multi-Conference on Systems, Signals & Devices (SSD); 2016 Mar 21-24; Leipzig, Germany. IEEE; 2016. pp. 459-67.

13. Peng Y, Zhou L, Du X, Sun P, Wang K, Cai J. Junction temperature estimation of IGBT module via a bond wires lift-off independent parameter VgE-np. IET Power Electron 2018;11:320-8.

14. Babel AS, Muetze A, Seebacher RR, Krischan K, Strangas EG. Inverter device nonlinearity characterization technique for use in a motor drive system. IEEE Trans Ind Applicat 2015;51:2331-9.

15. Wang H, Liu D, Fan Y, Wu Y, Qiao T, Yang DG. Modal analysis of IGBT power devices based on ANSYS. In: 2019 20th International Conference on Electronic Packaging Technology (ICEPT); 2019 Aug 4; Hong Kong, China. IEEE; 2019. p. 1-4.

16. Haque MS, Choi S, Baek J. Auxiliary particle filtering-based estimation of remaining useful life of IGBT. IEEE Trans Ind Electron 2018;65:2693-703.

Cite This Article

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OAE Style

Liu H, Li X, Liu Z. Health monitoring: the key technology for sustainable utilization of insulated gate bipolar transistors. Green Manuf Open 2024;2:7. http://dx.doi.org/10.20517/gmo.2024.032201

AMA Style

Liu H, Li X, Liu Z. Health monitoring: the key technology for sustainable utilization of insulated gate bipolar transistors. Green Manufacturing Open. 2024; 2(2): 7. http://dx.doi.org/10.20517/gmo.2024.032201

Chicago/Turabian Style

Liu, He, Xinyu Li, Zhifeng Liu. 2024. "Health monitoring: the key technology for sustainable utilization of insulated gate bipolar transistors" Green Manufacturing Open. 2, no.2: 7. http://dx.doi.org/10.20517/gmo.2024.032201

ACS Style

Liu, H.; Li X.; Liu Z. Health monitoring: the key technology for sustainable utilization of insulated gate bipolar transistors. Green. Manuf. Open. 2024, 2, 7. http://dx.doi.org/10.20517/gmo.2024.032201

About This Article

© The Author(s) 2024. Open Access This article is licensed under a Creative Commons Attribution 4.0 International License (https://creativecommons.org/licenses/by/4.0/), which permits unrestricted use, sharing, adaptation, distribution and reproduction in any medium or format, for any purpose, even commercially, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made.

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