fig12

Figure 12. (A) 3D-direct-ink-writing printing of FSSCs, fabrication, structure, and device demonstrations. Reproduced with permission^[53]; (B) Fabrication process and structural characterization of the fiber-shaped asymmetric supercapacitors. Reproduced with permission^[170]; (C) Schematic of printing coaxial FASC device by DCMW technology, structure, morphology, demonstration. Reproduced with permission^[171]. 3D: Three-dimensional; FSSCs: fiber-shaped supercapacitors; FASC: fiber-shaped asymmetric supercapacitors; DCMW: direct coherent multi-ink writing.