fig2

Figure 2. Voltage profiles of substrates with certain solubility in Li (A) and substrates with negligible solubility in Li (B) when Li deposited at a current density of 10 µA cm^-2. (C) SEM images of Cu substrate with gold strip arrays before (top) and after (bottom) Li deposition. Reproduced with permission from Ref.^[26]. Copyright 2016 Macmillan. (D) The relationship between thermodynamic nucleation overpotential and Li surface diffusion activation energies. Reproduced with permission from Ref.^[30]. Copyright 2019 American Chemical Society. (E) The repeated alloying and dealloying behavior of materials that only form solid solutions with lithium (top) and materials that form lithium intermetallic compounds (bottom). The schematic diagram and the corresponding potential profiles of the alloying and dealloying process of Ag@Cu (F) and Au@Cu (G) substrates during the initial lithium plating and stripping at a current density of 0.5 mA cm^-2. Reproduced with permission from Ref.^[31]. Copyright 2021 American Chemical Society. (H) The schematic diagram of the inward-growth plating of Li atoms into the Li-Ag alloy foil. (I) CE versus cycle number plot of Li₂₀Ag, Li₂₀Zn, and Cu anode. Reproduced with permission from Ref.^[32]. Copyright 2020 American Chemical Society.